Tuesday, 20 November 2007

Qualcomm Premieres Snapdragon, First Chipset Solutions to Break Gigahertz Barrier

Qualcomm, a developer and innovator of advanced wireless technologies and data solutions, has delivered the first chipset products from the Snapdragon platform to numerous device manufacturers.

Hailed as “groundbreaking”, the QSD8250 and QSD8650 offer a combination of mobile data processing, multimedia performance, 3G wireless connectivity and the lowest levels of power consumption for all-day battery life.

“As we expand from the traditional wireless handset market, Qualcomm’s Snapdragon platform will be the catalyst for a new era of innovative computing and consumer wireless mobile devices,” said Dr. Sanjay K. Jha, president of Qualcomm CDMA Technologies.

“The enthusiastic reception from leading electronics customers for our versatile gigahertz Snapdragon chipset heralds new possibilities for products blending the mobile phone, 3G wireless connectivity and computing capabilities with unsurpassed battery life.”

The QSD8250 supports HSPA data rates of up to 7.2 Mbps on the downlink and 5.76 on the uplink, with full backward compatibility. The dual-mode QSD8650 supports HSPA, as well as CDMA2000® 1xEV-DO Rev. B, with full backward compatibility. The two solutions feature a custom gigahertz microprocessor core paired with Qualcomm’s sixth-generation DSP core running at 600 MHz for unsurpassed mobile performance delivering an instant-on and always-connected user experience.

Snapdragon’s support for HD video decode, 12 megapixel camera, GPS, broadcast TV (using MediaFLO, DVBH-H and/or ISDB-T), Wi-Fi and Bluetooth is said to increase opportunities for device manufacturers to design compelling mobile products that make the promise of constant, seamless connectivity in an extremely thin and small form-factor a reality.